Leading technology research and Intellectual property Licensing company with industry-leading 3D integration solutions
Leveraging the combination of our highly experienced technologists, scientists and engineers and our advanced research and development labs in San Jose, California, Raleigh and North Carolina, we develop industry-leading 3D integration solutions such as hybrid bonding that meet the demand for greater functionality, higher performance and smaller size for next generation electronics.
– DBI Wafer to Wafer Hybrid Bonding
– DBI Ultra Die-to Wafer or Die to Die Hybrid Bonding
Adeia’s fundamental innovations underpin technology solutions that are shaping and elevating the future of digital entertainment and electronics, enabling the next generation of electronic devices. Adeia’s IP portfolios power the connected devices that touch the lives of millions of people around the world every day as they live, work, and play.
For more information, please visit www.adeia.com.