One of the world’s leading institutes for applied research and the development and system integration of robust and reliable electronics
Fraunhofer IZM specializes in applied and industrial contract research. Fraunhofer IZM’s focus is on packaging
technology and the integration of multifunctional electronics into systems. The institute promotes internationally
cutting-edge technology development and works on application areas and key development topics, ensuring the
research is advanced across technologies. In key development topics, the Fraunhofer IZM researchers monitor and
develop highly promising research questions, paving the way for future projects with industry.
The well-established wafer level pilot line can be utilized for prototyping and small volume production with advanced
wafer level bumping, wafer level redistribution, 2.5D/3D integration, fine pitch flip chip assembly, or photonics and
MEMS integration. Beyond silicon, we can process wide bandgap and III-V semiconductors as well as glass, ceramic,
and molded wafers. In the area of µLEDs we focus on bumping below 10 µm pitch (indium, gold, gold/tin, nanoporous
gold) and on massive parallel assembly technologies for micro-LEDs and on pixelated LED arrays.